TY - GEN
T1 - A robust, practical upper limb electromyography interface using dry 3D printed electrodes
AU - Abass, Ziad
AU - Meng, Wei
AU - Xie, Sheng Quan
AU - Zhang, Zhiqiang
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/7
Y1 - 2019/7
N2 - This study aims to develop a practical, robust and reliable human-machine interface using gesture recognition based on surface electromyography (sEMG) signals from the forearm. This technology is developed to be employed medically in stroke rehabilitation or prosthetic control. So far, studies have been conducted that improved the accuracy of such systems, but little has been done to avoid using wet (gelled) electrodes and hence improve their reliability and robustness for long-term use. Through this study, a comfortable and wearable bio- signal acquisition device is designed and developed that uses dry EMG electrodes. 3D printed electrodes are compared with ready-made dry ones to choose the better option, and an interface is established that allows control of any mechatronic system such as a prosthetic arm.
AB - This study aims to develop a practical, robust and reliable human-machine interface using gesture recognition based on surface electromyography (sEMG) signals from the forearm. This technology is developed to be employed medically in stroke rehabilitation or prosthetic control. So far, studies have been conducted that improved the accuracy of such systems, but little has been done to avoid using wet (gelled) electrodes and hence improve their reliability and robustness for long-term use. Through this study, a comfortable and wearable bio- signal acquisition device is designed and developed that uses dry EMG electrodes. 3D printed electrodes are compared with ready-made dry ones to choose the better option, and an interface is established that allows control of any mechatronic system such as a prosthetic arm.
KW - 3D-printed electrodes
KW - EMG interface
KW - Neuromuscular interface
KW - Wearable.
UR - https://www.scopus.com/pages/publications/85074278895
U2 - 10.1109/AIM.2019.8868500
DO - 10.1109/AIM.2019.8868500
M3 - 会议稿件
AN - SCOPUS:85074278895
T3 - IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM
SP - 453
EP - 458
BT - Proceedings of the 2019 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2019
Y2 - 8 July 2019 through 12 July 2019
ER -