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Giant electrical conductivity difference enabled liquid metal-hydrogel hybrid printed circuits for soft bioelectronics

  • Caicai Jiao
  • , Liangtao Li
  • , Baoyang Lu
  • , Qian Wang
  • , Weili Hong
  • , Xing Chen
  • , Lingqian Chang
  • , Xinpeng Wang
  • , Yang Wang
  • , Kang Sun
  • , Liang Hu
  • , Yubo Fan
  • Beihang University
  • Jiangxi Science and Technology Normal University

科研成果: 期刊稿件文章同行评审

24 引用 (Scopus)

摘要

Soft printed circuits is a vital component in electronic devices, which is designed to connect electrical components to exert certain functions. However, the design and fabrication of soft printed circuits still suffer from significant limitations including interconnection difficulties among varying materials with different stiffness, intrinsically low conductivity of typical soft materials like hydrogels, and the multi-material assembly and integration issues involved in the wiring and encapsulation process. Here we report a novel design paradigm of a soft printed circuit termed as liquid metal (LM)-hydrogel hybrid printed circuit (LMH-HPC), in which highly conductive LM functions as electrical wires while hydrogel can simultaneously work as the electrical junction, encapsulation, and bio-interfacing. The whole LMH-HPC maintains completely mechanically adapted (∼1–30 kPa) to soft tissues. Based on this LMH-HPC, we design soft hybrid circuits with movable but stable electrical connections with conventional solid electrical components. Owing to the giant electrical conductivity difference between LM and hydrogel, the current through the hydrogel can be tuned with density distribution at the hydrogel junction, which can be further utilized as the soft and safe bioelectronic interfaces for applications such as soft electrical stimulators for excitable cells and tissues, and iontophoresis-assisted wound dressing for antibacterial therapy. Overall, this LMH-HPC may set up a multifunctional platform for the design of hydrogel electronic devices.

源语言英语
文章编号148951
期刊Chemical Engineering Journal
482
DOI
出版状态已出版 - 15 2月 2024
已对外发布

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