TY - GEN
T1 - Ultra-thin Flexible Neuro Probe Utilizing Biodegradable Collagen Microneedle∗∗Resrach supported by National Natural Science Foundation of China (62004007), National Key Research and Development Program (2016YFA0200802), China Postdoctoral Science Foundation Grant (2019M660309), and the China Capital Health Research and Development of Special (2018-1-4111).
AU - Huang, Dong
AU - Li, Junshi
AU - Wang, Zhongyan
AU - Zhang, Zhitong
AU - Wang, Qining
AU - Li, Zhihong
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021/4/25
Y1 - 2021/4/25
N2 - In this paper, we proposed a flexible neuro probe with the biodegradable microneedle as a carrier for reliable and long-term neuro recording. The ultra-thin Parylene microelectrode mesh was assembled on a needle-shaped collagen suture with assistance of surface tension. After penetration into brain, the collagen suture can be degraded and absorbed gradually, resulting in the recovery of the glial scar and leaving ultra-thin Parylene mesh embedded in tissue. Hence, such a strategy can significantly reduce the potential safety hazard and conduct satisfactory contact between microelectrodes and nerve cells in the long-term implantation. This device is expected to offer a general tool for experimental neuroscience study and clinic application.
AB - In this paper, we proposed a flexible neuro probe with the biodegradable microneedle as a carrier for reliable and long-term neuro recording. The ultra-thin Parylene microelectrode mesh was assembled on a needle-shaped collagen suture with assistance of surface tension. After penetration into brain, the collagen suture can be degraded and absorbed gradually, resulting in the recovery of the glial scar and leaving ultra-thin Parylene mesh embedded in tissue. Hence, such a strategy can significantly reduce the potential safety hazard and conduct satisfactory contact between microelectrodes and nerve cells in the long-term implantation. This device is expected to offer a general tool for experimental neuroscience study and clinic application.
UR - https://www.scopus.com/pages/publications/85113335294
U2 - 10.1109/NEMS51815.2021.9451272
DO - 10.1109/NEMS51815.2021.9451272
M3 - 会议稿件
AN - SCOPUS:85113335294
T3 - Proceedings of the 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021
SP - 1839
EP - 1842
BT - Proceedings of the 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021
Y2 - 25 April 2021 through 29 April 2021
ER -